Research to the Uniformity of Ni-Co Alloy Electroforming

Abstract:

The effects of additive TN1, power waveforms (full wave, half wave, and direct current), current density and pH on the throwing power of Ni-Co alloy electroforming solution had been investigated by orthogonal tests; and the effects of plating parameters on current distribution of cathode by ANSYS numerical simulation were discussed. The results of orthogonal test showed that the additive TN1 had the largest effect on the throwing power; the power waveform was secondary; the current density and pH had minor effect. The biggest throwing power was 78% when the TN1 was 15g/L and waveform was full wave. Numerical simulation showed that the cathode shape and shield had effect on current distribution; reasonable cathode shape and application of shield could improve the current distribution. The thickness uniformity of part could be up to 92% by optimizing of electrolyte, adjusting the electroforming technics and applying second electroplating.

• Periodical: Advanced Materials Research (Volumes 479-481)
• Pages: 497-503
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.479-481.497
• Online since: February 2012
• Authors: He Zhong Pei, Jun Zhang, Guo Liang Zhang, Pan Huang
• Keywords: Current Distribution, Electroforming, Ni-Co Alloy, Numerical Simulation, Throwing Power

References

[1] J.A. McGeough, M.C. Leu, K.P. Rajurkar, A.K.M.De Silva, Qulin.Electroforming process and application to micro/macro manufacturing. Annals of the CIRP; 2001, 50: 499-514.

DOI: 10.1016/s0007-8506(07)62990-4

[2] S.M. Silaimani, S.John.Review on recent advances in electroforming during the last decade.Bulletin of Electrochemistry;2001, 17: 553-560.

[3] Meenu Srivastava etc. Corrosion resistance and microstructure of electrodeposited nickel-cobalt alloy coatings. Surface & Coatings Technology;2006,201: 3051-3060.

DOI: 10.1016/j.surfcoat.2006.06.017

[4] Renáta Oriňáková etc. Influence of pH on the electrolytic deposition of Ni-Co films. Thin Solid Films;2008,516:3045-3050.

DOI: 10.1016/j.tsf.2007.12.081

[5] C.K. Chung, W.T. Chang. Effect of pulse frequency and current density on anomalous composition and nanomechanical property of electrodeposited Ni-Co films.Thin Solid Films;2009: 1-5.

DOI: 10.1016/j.tsf.2009.03.087

[6] Guiying Qiao, Tianfu Jing, Nan Wang, etc.High-speed jet electrodeposition and microstructure of nanocrystalline Ni-Co alloys. Electrochimica Acta;2005, 51: 85-92.

DOI: 10.1016/j.electacta.2005.03.050

[7] Jian-Ming Yang, Dong-Hyun Kim, Di Zhu, etc.Improvement of deposition uniformity in alloy electroforming for revolving parts.International Joumal of Machine Tools & Manufacture;2008, 48: 329-337.

DOI: 10.1016/j.ijmachtools.2007.10.006

[8] S.D. Leithm, D.T. Schwartz. High-rate through-mold electrodeposition of thick (>200μm) NiFe MEMS components with uniform composition.Journal of Microelectromechanical Systems; 1999,8: 384-392.

DOI: 10.1109/84.809052

[9] F.Elsner.Thickness distribution for gold and copper electroformed hohlraums. Fusion Technology;1999,35: 81-84.

DOI: 10.13182/fst99-a11963906

[10] W.C. Tsai, C.C. Wan, Y.Y. Wang. Frequency effect of pulse plating on the uniformity of copper deposition in plated through holes.Journal of the Electrochemical Society; 2003, 150: C267-C272.

DOI: 10.1149/1.1560942

[11] Y.J. Tan, K.Y. Lim.Understanding and improving the uniformity of electrodeposition. Surface and Coating Technology; 2003,167: 255-262.

DOI: 10.1016/s0257-8972(02)00916-7

[12] S.John, V.Ananth, T.Vasudevan.Improving the deposit distribution during electroforming of complicated shapes.Bulletin of Electrochemistry; 1999, 15: 202-204.

[13] J.M. Lee, J.T. Hachman, J.J. Kelly, A.C. West. Improvement of current distribution uniformity on substrates for microelectrlmechanical systems. Journal of Microlithography, Microfabrication, and Microsystems;2004, 3: 146-151.

[14] Hongxiang Zhang, Wei Wang. Technology of Electroplating. Tanjin: Tanjin publishing house of science and technology;2004,pp.40-50.