Analysis about Infrared Thermal Imaging Detection on Building Envelope and Material Defect Cases

Fei Guo; Pei Sheng Zhu; Shu Guo Liu; Shen Jian Hu

doi:10.4028/www.scientific.net/AMR.485.16

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 485Analysis about Infrared Thermal Imaging Detection...

Analysis about Infrared Thermal Imaging Detection on Building Envelope and Material Defect Cases

Abstract:

In order to explore thermal imaging technologies’ applicability in building envelope and material defection, laboratory experiments and field tests have been carried out to record typical defection thermal images in the climate of Dalian area. Based on one typical building defection case, with its thermal images and working drawing, the effect of material and constructions on the nature and reason of its defection has been carefully analyzed, which can lead us to the conclusions that external insulation construction of building envelope of tiles facing can easily cause bursting or dropping accidents in Dalian area.

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Periodical:

Advanced Materials Research (Volume 485)

Pages:

16-22

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.485.16

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Online since:

February 2012

Authors:

Fei Guo, Pei Sheng Zhu, Shu Guo Liu, Shen Jian Hu

Keywords:

Building Enclosure Defect, Engineering Quality Detection, Infrared Thermal Imaging

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References

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