Design of Tactile Sensor for Measuring Orthocenter Deviation and Friction in Wafer Transmission Process

Abstract:

In order to raise position accuracy and stability in wafer transmission process, a tactile sensing system which can measure both deviation of wafer to manipulator and friction acting on wafer simultaneously is introduced. Analysis on kinetic model abstracted from sensing system is made, and following algorithms are applied: micro displacement is calculated through pressure values acting on different sensing units, and meanwhile friction is calculated from relative velocity between permanent magnet and inductance. Through simulation, indicators of sensing unit are established. This sensing system has the capacity of detecting deviation ranging 0-5 mm with resolution 0.05 mm and measure friction ranging 0-0.64 N. The results indicate that this sensing system meets the requirements in orthocenter deviation and friction measurement in wafer transmission process.

• Periodical: Advanced Materials Research (Volumes 488-489)
• Pages: 1752-1756
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.488-489.1752
• Online since: March 2012
• Authors: Jiang Wu, Yan Jie Liu, Hai Jun Han, Li Ning Sun
• Keywords: Friction Measurement, Micro Displacement Measurements, Tactile Sensor, Wafer Transmission

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