Rheological Behavior of Diamond Particle/Epoxy Resin Adhesive Adapted to Screen Printing

Yong Lv; Song Ci; Long Zhu

doi:10.4028/www.scientific.net/AMR.499.308

Paper Titles

Simulation of Cavitation Erosion in Different Throttling Pipelines
p.288

Research on Reproduction Characteristics of Digital Laser Plate
p.293

Numerical Simulation of Steel Plate Processed by Shot-Peening
p.298

General Rotation Union Design Experiment for Seed Dispensing Performance of Seed Metering Disc
p.303

Rheological Behavior of Diamond Particle/Epoxy Resin Adhesive Adapted to Screen Printing
p.308

Research of the Factor that Influence the Ink Printing Density of Water-Based Gravure Ink
p.312

Study on the Deformation and Fracture of Bolted Roadway with Infrared Characteristics
p.317

Three-Dimensional Finite Element Simulation Analysis of Jinliang Rive Inverted Siphon Structure
p.322

Finite Element Method Mechanical Characteristics Analysis of Tower Foundation for Wind Turbine Generator System
p.327

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 499Rheological Behavior of Diamond Particle/Epoxy...

Rheological Behavior of Diamond Particle/Epoxy Resin Adhesive Adapted to Screen Printing

Abstract:

The thermal conductivity & insulating adhesive was prepared by mixed with diamond particles, epoxy resin (E-20), methanol etherified amino resin, ethylene glycol monobutyl ether (BCS), mixed diethyl ester (DBE), and other additives. The influence on rheological behavior of different particle sizes, volume content of diamond particles was studied. Meantime, the effect of different concentration of dispersant and flatting agent was also investigated. The mechanism of the rheological behavior was analyzed.