Optimization of Slicing Parameters of Single Crystal Silicon Sliced by Diamond Wire Saw

J.F. Meng; Y.P. Han

doi:10.4028/www.scientific.net/AMR.500.89

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 500Optimization of Slicing Parameters of Single...

Optimization of Slicing Parameters of Single Crystal Silicon Sliced by Diamond Wire Saw

Abstract:

The slicing technology of hard-brittle materials by endless diamond wire saw has the advantages of higher moving speed of wire saw, better slicing quality, and thin kerf. According to the strength of wire saw, the cutting force and the random vibration of wire saw, the slicing parameters are optimized. As single crystal silicon is sliced, the constant feed force is less than 10N, the maximum pretension is 30N, and the highest moving speed of wire saw is 24m/s. But because the restrict of machine precision, the highest slicing speed is 16m/s.

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Periodical:

Advanced Materials Research (Volume 500)

Pages:

89-93

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.500.89

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Online since:

April 2012

Authors:

J.F. Meng, Y.P. Han

Keywords:

Diamond Wire Saw, Optimization of Parameters, Silicon

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References

[1] W.I. Clark, A.J. Shih and C.W. Hardin: International Journal of Machine Tools & Manufacture, Vol. 43 (2003) No.3, p.523.

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[2] C.W. Hardin, J. Qu and A.J. Shih: MATERIALS AND MANUFACTURING PROCESSES, Vol. 19 (2004) No.2, p.355.

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[3] J.F. Meng: Research on Machined Technology and Machined Quality of Endless Electroplated Diamond Wire Saw. (Ph.D., Shandong University, China 2006), p.25 (In Chinese) .

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