An Approach of Signal Analysis Based on High-Order Spline Interpolation

Article Preview

Abstract:

Empirical mode decomposition (EMD) provides a powerful tool for the nonlinear and nonstationary signals. This paper presents an application of the signature analysis based on high-order spline interpolation. The time-frequency analysis method based on EMD is introduced. The series data are separated into intrinsic mode functions (IMFs) with different time scale using EMD. The spectrum of Hilbert transformation is obtained by applying Hilbert transformation to every IMF. Based on cubic spline interpolation, high-order spline interpolation is used to improve the precision of the algorithm. Furthermore some strategies for improving the computational efficiency are proposed. The simulation result shows that the precision of the time-frequency analysis can be improved effectively using the proposed new algorithm.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

226-230

Citation:

Online since:

April 2012

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] C.A. Reymondin, G. Monnier, D. Jeanneret, U. Pelaratti, The Theory of Horology, Swiss Federation of Technical Colleges, Switzerland, (1999).

Google Scholar

[2] S. Su, R. Du. Signature analysis of mechanical watch movements. Mechanical Systems and Signal Processing. 21 (2007) 3189–3200.

DOI: 10.1016/j.ymssp.2007.04.006

Google Scholar

[3] Y. Fu, R. Du, A Study on the Dynamics of Swiss Lever Escapement Mechanism, International Symposium on Collaborative Research in Applied Science, Vancouver, Canada, 2005, p.8–15.

Google Scholar

[4] The official website of MicroSet: http: /www. bmumford. com/microset. html.

Google Scholar

[5] Official website of Witschi Electronic Ltd., Switzerland, Basic Training, http: /www. witschi. com/download/Training_EN. pdf.

Google Scholar

[6] S. Su, R. Du, Signature analysis of mechanical watch movements, Second Asian International Symposium on Mechatronics, Hong Kong, December, (2006).

Google Scholar