TTSP-Based Study on Residual Life Prediction of Shipboard Cable

Yi Wei; Yan Cheng Liu; Yu Dong Liu; Chuan Wang

doi:10.4028/www.scientific.net/AMR.516-517.1843

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 516-517TTSP-Based Study on Residual Life Prediction of...

TTSP-Based Study on Residual Life Prediction of Shipboard Cable

Abstract:

In this paper, TTSP is used to demonstrate that the aging characteristic quantity at high temperature accords with that at low temperature, and to predict the residual life of shipboard cable. The aging process of cable is described based on second order dynamic model. The method is proved effective by the experimental data, and provides theoretical bases for residual life of cable and cable anti-aging study under the influence of multi-factors.

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Periodical:

Advanced Materials Research (Volumes 516-517)

Pages:

1843-1847

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.516-517.1843

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Online since:

May 2012

Authors:

Yi Wei, Yan Cheng Liu, Yu Dong Liu, Chuan Wang

Keywords:

Prediction, Residual Life, Shipboard Cable, TTSP

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