Sensitivity Analysis for the Junction Temperature Measurement of the LED 12

Article Preview

Abstract:

LED have the special character that LED break out radiant power and heat when it is operating. Recently photo efficiency of LED is just 20% and almost residual power converts heat. But heat causes bad reliability and changes of electrical and optical character negatively. Therefore, the LED package design is the first issue for the solution of the heat problem. This study was to design a LED T-junction measurement platform which based on the required of JEDEC-51-1. The experiment results include four parts: (1) Manually retrieve VFss voltage, the temperature raised around 3~5°C between the chip junction temperature and LED pin; (2) Automatically retrieve VFss voltage, the temperature raised around 30~50°C for the same condition; (3) From trend of TJ vs. time, the definition of the steady state require at least 900 sec, but we would suggest 1200 sec in this study; (4) There is no significant difference of the TJ for the retrieval time 100 μs and 10μs. The important achievement of the results of this experiment can be used as a reference for TJ measurement.

You might also be interested in these eBooks

Info:

Periodical:

Advanced Materials Research (Volumes 516-517)

Pages:

425-432

Citation:

Online since:

May 2012

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] V. Sztkely, "A New Evaluation Method of Thermal Transient Measurement Results", Microelectronics Journal, Vol. 28, No. 3, 1997, pp.277-292.

Google Scholar

[2] LED lighting and quality standard ,No.003,2008, Taiwan。

Google Scholar

[3] JEDEC Standard EIA/JESD51-1, "Integrated Circuits Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device).", (1995)

Google Scholar

[4] Eric G. T. Bosch & Clemens J.M. Lasance, "Accurate Measurement of Interface Thermal Resistance By Means of a Transient Method", Philips Research Laboratories, sixteenth IEEE SEMI-THERMTM symposium, 2000, p.167-P. 173.

DOI: 10.1109/stherm.2000.837080

Google Scholar

[5] Y. H. Cheng, W. K. Lin, "Geometric optimization of thermoelectric coolers in a confined volume using genetic algorithms", Applied Thermal Engineering, 25, p.2983~2997, (2005)

DOI: 10.1016/j.applthermaleng.2005.03.007

Google Scholar

[6] Pen-Cheng Wang , Chen-I Chao, Wei-Keng Lin, Sz-Yuan Hung, "All-Polymer Variable Resistors as Pressure-Responsive Devices Photochemically Assembled Using Porous Composites and Flexible Electrodes Based on Conducting Polymers", Journal of the Chinese Institute of Engineers (JCIE), 2010, Nov.

DOI: 10.1080/02533839.2012.679113

Google Scholar