Simulation on Ice Slurry Cooling High Integrated Electronic Chip as a Functional Material

Abstract:

Traditional cooling methods for electronic chips cannot fully meet the increasing cooling requirement of chips with high heat flux at present, so finding high-efficiency and low-cost cooling functional materials, and cooling methods with high efficiency has been a hot spot to explore. In this article, using Fluent 6, we construct a grooved channel physical model and analyze cooling effects of ethylene glycol/water ice slurry as a functional material on the chips under conditions that baffle lengths are 60mm, 80mm and 90mm, the mass flow rates are 0.4kg/s, 0.3kg/s and 0.2kg/s, and the ice fractions are 15%, 20%, 25% respectively. The results show that the chip cooling rate is increasing effectively and the temperature uniformity is better as well as the utilization rate of the latent heat is increasing as the length of baffles, the mass flow rate and the ice fraction are increasing, but the pressure loss resulted from the local effects of the inlet and corners cannot be ignored. Considering the cooling effect and the uniformity of temperature field, the length of baffles should be 83%-93% of length of flow path. In practical projects, the temperature difference between inlet and outlet should be reduced and the diameter of pipes should be decreased in order to take full advantage of the huge latent heat of the ice slurry while the ice is completely melted. Therefore, ice slurry as a functional material has a great potential to cool high integrated electronic chips.

• Periodical: Advanced Materials Research (Volume 531)
• Pages: 256-260
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.531.256
• Online since: June 2012
• Authors: Wen Wen Zhang, Jun Zhao, Yi Lin Cui, Liu Hua Gao, Ming Hui Ge, Fei Bo Wang
• Keywords: Electronic Chip, Functional Material, Heat Transfer Enhancement, Ice Slurry, Simulation

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