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Study on the Polyethyleneglycol-Based Silicon Wafer Wire Cutting Fluid for its Stability Improvement
Abstract:
Thermogravimetry (TG) analysis was employed to investigate the effects of antioxidants on the temperature response of PEG200 at 5% and 10% weight loss respectively, and to compare the TG profiles of cutting fluid 010 with that of PEG200 adulterated with antioxidants. Thermal aging method was utilized to survey the electrical conductivity, pH value and relative viscosity of PEG600 stock solution. Meanwhile, effects of 13 antioxidants on the anti-thermal oxidation activity of PEG600 was studied and the properties of the antioxidant-modified PEG were compared with that stipulated by the trade standard of silicon wafer cutting fluid in terms of electrical conductivity, pH value and relative viscosity. The results showed that addition of antioxidants such as 626, 1098, B900 and p-hydroxyanisole increased the temperature of PEG200 at weight loss significantly. A large disparity was displayed between the thermal gravity curves of cutting fluid 010 and that of antioxidants-containing PEG200. Electrical conductivities for all 13 PEG600 samples with anti-oxidants after thermal aging excel that of the manufacture’s standard. All antioxidant-modified PEG600 samples, except that containing DLTP and 626, satisfy the criteria of pH value by the manufacture’s standard. The viscosity of PEG600 changed little after adding antioxidants 1010 and B225, which revealed that these two antioxidants posses certain property of inhibiting polymerization of PEG600.
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67-72
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June 2012
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© 2012 Trans Tech Publications Ltd. All Rights Reserved
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