Research and Development of Parylene Thin-Film Deposition and Application for Water-Proofing

Wen Cheng Kuo; Chao Yang Hsu

doi:10.4028/www.scientific.net/AMR.538-541.23

Paper Titles

The Fabrication of La_0.9Sr_0.1CoO₃ Thin Films and its LITV Effect Applications
p.3

Influence of Co Removal for Improving Diamond Films Adhesive on WC-Co Substrates by DC-PCVD
p.7

Influence of Sputtering Pressure for Radio Frequency Magnetron Sputtering (103) Oriented AlN Films on (100) Silicon Substrate
p.12

Study on the Titanium Film in the Pressure Self-Adaptive Water-Tight Junction Box of Underwater Vehicle
p.16

Research and Development of Parylene Thin-Film Deposition and Application for Water-Proofing
p.23

A Novel Polyethersulfone Flat Sheet Membrane Prepared from a Lower Critical Solution Temperature System
p.29

A Development of Polarization Experimental Processes and Analysis Mechanical Behavior for COC and PVDF Films
p.33

Fabrication and Characterization of Ga and N Co-Doped SnO₂ Films by MOCVD
p.37

Development High Stiffness Ratio of Stiffened Membranes for Small Flat Speakers
p.44

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 538-541Research and Development of Parylene Thin-Film...

Research and Development of Parylene Thin-Film Deposition and Application for Water-Proofing

Abstract:

This research presents the development of parylene thin-film deposition from the micrometer scale to nanometer scale. Processes improved film uniformity by 6% in the nanometer scale to meet the requirements of new applications of parylene, such as the delamination layer of organic light-emitting diodes, the dielectric film of through-silicon-via, and water-proofing mobile phones. The application and process of water-proofing mobile phones is also examined. The tested mobile phone was coated with a 0.5 μm parylene coating and functioned properly while submerged underwater. The mobile phone is still operational; thus, nanoscale parylene deposition is a novel application for water-proofing mobile phones. The application does not concern problems associated with parts assembly or damaged rubber material.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 538-541)

Pages:

23-28

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.538-541.23

Citation:

Cite this paper

Online since:

June 2012

Authors:

Wen Cheng Kuo, Chao Yang Hsu

Keywords:

Mobile Phone, Nanometer Scale Thin-Film Deposition, Parylene, Water-Proof

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Y. -C. Tai: 2005 IEEE international Conference on Robotics and Biomimetics (ROBIO2005), pp.26-29.

Google Scholar

[2] L. -Q. Wu: Electro-Mechanical Engineering, 20 (2004) pp.51-61. (in Chinese).

Google Scholar

[3] V. S. Kale and T. J. Riley: IEEE Transactions on Parts, Hybrids, and Packaging, PHP-13 (1977) pp.273-279.

DOI: 10.1109/tphp.1977.1135214

Google Scholar

[4] L. Ke, R. S. Kumar, K. Zhang, S. J. Chua, and A. T. S. Wee: Synthetic Metals, 140 (2004), pp.295-299.

Google Scholar

[5] B. Majeed, N. P. Pham, D. S. Tezcan, and Eric Beyne: Electronic Components and Technology Conference (2008), pp.1556-1561.

Google Scholar

[6] M. Ji, Y. Zhu, S. Ma, X. Sun, Min Miao, and Y. Jin: International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009), pp.60-63.

DOI: 10.1109/icept.2008.4606931

Google Scholar