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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 548A New Palladium-Free Surface Activation Process...

A New Palladium-Free Surface Activation Process for Cu Electroless Plating on ABS Plastic

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Abstract:

An environment-friendly surface etching and activation technics for ABS surface metallization were investigated as a replacement for conventional chromic acid etching bath and palladium catalyst. After etching by H₂SO₄-MnO₂ colloid, the ABS surfaces became roughness; meanwhile the carboxyl and hydroxyl groups were formed on the surface. With absorption and a reduction by a dimethylamineborane solution, nickel particles were deposited on the ABS surface, which serves as a catalyst replacement for SnCl₂/PdCl₂ colloid. The effects of NiSO₄ concentration, (CH₃) ₂NHBH₃ concentration, reduction temperature and reduction time on the adhesion strength between the ABS surface and the electroless copper film were investigated.

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Material and Manufacturing Technology III

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Periodical:

Advanced Materials Research (Volume 548)

Pages:

54-57

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.548.54

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Online since:

July 2012

Authors:

Xu Wang

Keywords:

ABS Resin Material, Electroless Copper, Electroless Plating (EP)

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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