Research and Simulation of MEMS Polycrystalline Silicon Resonance Mass Beam Sensor

Article Preview

Abstract:

The corresponding development of resonance mass beam pressure sensor in decades is introduced and a serial of theory analysis is executed. The advantages and disadvantages are studied on the resonance mass pressure sensor. Through the finite element analysis software ANSYS, the stress and strain distribution situation is obtained in this paper. Under the outside overload pressure situation, we find that the linearity of the resonance mass beam pressure sensor presents a declining situation, but in a small range. From the total performances of sensor, it still keeps a good condition. Under the 260 times of rang pressure, the sensor chip deformation is only 14.5um, which is a kind of very small deformation situation. That is to say the resonance polycrystalline silicon mass beam sensor designed here has a high reliability under the outside overload pressure situation.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

630-633

Citation:

Online since:

July 2012

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] MIDDELHOEK S Celebration of the tenth transducers conference: the past, present and future research and development 2000(82).

Google Scholar

[2] Wang Shuhua. Current Status and Applications of MEMS Sensors Micronanoelectronic Technology2011(8).

Google Scholar

[3] MEYYAPPAN K. MCCLUSKEY P. CHEN L Y Thermo-mechanical analysis of MEMS pressure sensor die-attach for high temperature applications (2004).

DOI: 10.1109/aero.2004.1368049

Google Scholar

[4] Hac Timans, M Elwenspoek, JHJ Fluitman. Micro resonant force gauges[J]. Sensors and Actuators A, 1992, 30.

DOI: 10.1016/0924-4247(92)80194-8

Google Scholar

[5] Harrie A C Tilmans, Siebe Bouwstra. A Novel Design of a Highly Sensitive Low Differential-pressure Sensor Using Built-in Resonant Strain Gauges[j] Journal of Micromechanics and Microengineering, 1993, 3.

DOI: 10.1088/0960-1317/3/4/007

Google Scholar

[6] Liu Tao, Yang Fengpeng. Proficient of Ansys. Tsinghua University press, (2002).

Google Scholar