Study on Improved Grinding Process of Sapphire with LED Substrate Material in Manufacturing Engineering

Hai Zhou; Xiao Ming Xu; Zhi Guo Zhuo; Yue Zang; Ruo Xi Xu; Huan Feng

doi:10.4028/www.scientific.net/AMR.583.314

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 583Study on Improved Grinding Process of Sapphire...

Study on Improved Grinding Process of Sapphire with LED Substrate Material in Manufacturing Engineering

Abstract:

Method for grinding by adding rubber pad between LED sapphire substrate and ceramic supporting is proposed though the ANSYS finite element analysis, which obtains high flatness of the surface of a substrate efficiently. The experimental results also confirmed that after grinding the 2-inch sapphire substrate in the cushion, the total thickness of the error (TTV) <4 microns and the BOW <3 microns. Therefore, the upholstered film is one of the efficient, economic and highly automated ways to grind sapphire substrate.

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Periodical:

Advanced Materials Research (Volume 583)

Pages:

314-317

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.583.314

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Online since:

October 2012

Authors:

Hai Zhou, Xiao Ming Xu, Zhi Guo Zhuo, Yue Zang, Ruo Xi Xu, Huan Feng

Keywords:

Bow, Robber Pad Grinding, Sapphire, TTV

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