Development of the Manufacture Equipment for Resin Bonded Diamond Abrasive Wire Saw

Wen Bo Bi; Pei Qi Ge; Yu Fei Gao; Zhen Jie Zhu

doi:10.4028/www.scientific.net/AMR.588-589.1694

Paper Titles

One-Step Synthesis of Thin Graphite Layers Supported CNTs in Porous Copper by CVD
p.1677

In Situ Synthesis of CNTs/Mg Composite Powders by CVD at Low Temperatures
p.1681

Study on Mechanism of Molybdenum Concentrate Carbon-Free Roasting
p.1685

Experimental Study on Recovering Molybdenum from One Processed Tailing in Bai Shi Zhang Plant
p.1689

Development of the Manufacture Equipment for Resin Bonded Diamond Abrasive Wire Saw
p.1694

Research on Cutting Force and Surface Roughness in Face Milling Ni-Based Superalloy
p.1698

The Effect of Molding Process and Test Conditions on the Thermal Conductivity of Polypropylene/Graphite Composites
p.1702

Study on the Aging Regularity of SWRH82B Hot-Rolling Wire Rod
p.1709

Development and Application of the Tiger Punch
p.1714

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 588-589Development of the Manufacture Equipment for Resin...

Development of the Manufacture Equipment for Resin Bonded Diamond Abrasive Wire Saw

Abstract:

This paper introduces the structure of the resin bonded abrasive wire saw manufacture equipment. The equipment can complete the process of the wire saw production, including uncoiling wire, cleaning wire, binder coating, Pre-curving and coiling wire. Wire saw are manufactured successfully by this equipment in the manufacture experiment. The quality of the wire saw was examined by SEM. The average slicing ability of the wire saw is 205 mm2 per meter in the experiment of KDP crystal slicing.