Development of the Manufacture Equipment for Resin Bonded Diamond Abrasive Wire Saw

Abstract:

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This paper introduces the structure of the resin bonded abrasive wire saw manufacture equipment. The equipment can complete the process of the wire saw production, including uncoiling wire, cleaning wire, binder coating, Pre-curving and coiling wire. Wire saw are manufactured successfully by this equipment in the manufacture experiment. The quality of the wire saw was examined by SEM. The average slicing ability of the wire saw is 205 mm2 per meter in the experiment of KDP crystal slicing.

Info:

Periodical:

Advanced Materials Research (Volumes 588-589)

Edited by:

Lawrence Lim

Pages:

1694-1697

Citation:

W. B. Bi et al., "Development of the Manufacture Equipment for Resin Bonded Diamond Abrasive Wire Saw", Advanced Materials Research, Vols. 588-589, pp. 1694-1697, 2012

Online since:

November 2012

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$38.00

[1] C.W. Hardin, J. Qu, A.J. Shih: Materials and Manufacturing Processes Vol. 2 (2004), p.355.

[2] P.Q. Ge: Diamond & Abrasives Engineering Vol. 6 (2006), p.12.