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Borax Modify Phenol-Formaldehyde Resin as Wood Adhesives

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Abstract:

A modified phenol-formaldehyde (PF) resin was synthesized under alkaline condition in varying proportion of borax up to 21% (w/w). All the prepared resin were characterized by free phenol content, free formaldehyde content as well as hydroxymethyl content. It was proved by Fourier transform infrared spectrometer (FTIR) that B-O bond had been successfully introduced into the structure of PF resin. Thermo gravimetric analyzer (TGA) and different scanning calorimetry (DSC) were used to characterize the thermodynamic characteristics of the PF resin. The result showed that when the mass fraction of borax was 9wt.% of PF resin, the heat resistance was the best and the curing temperature of the modified PF resin was higher than that of the unmodified PF resin.

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Periodical:

Advanced Materials Research (Volumes 610-613)

Pages:

507-513

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.610-613.507

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Online since:

December 2012

Authors:

Rui Hang Lin, Xiao Feng Zhu, Xiao Bo Wang, Zhen Zhong Gao

Keywords:

B-O Bond, Borax, Heat Resistance, Phenol-Formaldehyde Resin

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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