Intermetallic Evolution of Sn-3.5Ag-1.0Cu-0.1Zn/Cu Interface under Thermal Aging

Abstract:

Due to environmental concerns, lead-free solders were introduced in replacing the lead-based solders in microelectronics devices technology. Although there are many lead-free solder available, the Sn-Ag-Cu is considered the best choice. But the solder has its draw backs in terms of melting temperature and intermetallic formations. To improve the solder, a fourth element Zn was added into the solder. The new composite solders were synthesized via powder metallurgy route. This research studies the effect of 0.1wt% Zn addition on the hardness and intermetallic formation on Cu substrate. For the hardness results, the micro Vickers values were reported. For intermetallic, the solders were melted at 250°C and aged at 150°C until 400 hours. The microhardness value for Zn based composites solder shows higher micro Vickers hardness compared to un-doped counterparts. The phases formed and its growth was studied under SEM and by energy dispensive x-ray (EDX). The SEM results show the presence of Cu₆Sn₅ and Cu₃Sn intermetallics and the Cu₅Zn₈ intermetallic was not detected. The addition of 0.1wt% Zn has retarded the growth of the Cu₃Sn intermetallic but not the total intermetallic thickness.

• Periodical: Advanced Materials Research (Volume 620)
• Pages: 142-146
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.620.142
• Online since: December 2012
• Authors: Iziana Yahya, Noor Asikin Ab Ghani, Nur Nadiah Zainal Abiddin, Hamidi Abd Hamid, Ramani Mayappan
• Keywords: Hardness, Intermetallic, Powder metallurgy, Sn-Ag-Cu-Zn Solder, X-Ray Diffraction (XRD)

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