Research on Performance of Epoxy Electronic Packaging Materials

Abstract:

This article the epoxy resin electronic packaging materials was prepared via epoxy resin E-51 as matrix resin, MNA for curing agent, the CTBN as toughening agents, BPO, DMP-30, Al(MM)3, 2E4MZ as curing promoting agents by mechanical blending. The cured condition was 80°C curing 2 h, 90°C curing 2 h, 100°C curing 5 h. The structure of the epoxy resin electronic packaging materials was characterized via FT-IR, the result showed that epoxy resin cured completely. Dynamic mechanical analysis (DMA) is evaluated material thermal stability. The results show that anhydride dosage 7.7 g. The dielectric loss and volume resistivity of epoxy electronic potting were measured via the electrical performance analysis. The results show that epoxy electronic potting having BPO (0.2 g) and DMP-30 (0.1 g) had electrical optimal performance. In the curing process conditions, its performance is meet potting requirements, curing process is feasible.

• Periodical: Advanced Materials Research (Volume 668)
• Pages: 226-230
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.668.226
• Online since: March 2013
• Authors: Hao Ran Zhou, An Sun, Hao Cheng Yang, Shuang Zhao
• Keywords: Curing Process, Epoxy Encapsulating Material, MNA, Promoting Agents

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