The Effect of Heat Treatment on Microstructure and Performance of Die Forging Copper

Gui Rong Yang; Wen Ming Song; Ying Ma; Yuan Hao

doi:10.4028/www.scientific.net/AMR.690-693.58

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 690-693The Effect of Heat Treatment on Microstructure and...

The Effect of Heat Treatment on Microstructure and Performance of Die Forging Copper

Abstract:

The copper specimen was fabricated through liquid die forging under optimum technical parameter, and the die forging copper was annealed under different conditions. The effect of annealing treatment on the microstructure, strength, hardness and electric conductivity of die forging copper was investigated. The results show that the microstructure of die forging copper was changed into equiaxed grain when the treating temperature was less than 250 °C and treating time was less than 2.0 h. The restoration and recrystallization happened during treatment and the obtained crystal grain size became smaller. The strength of die forging copper decreased after annealing treatment owing to the decreasing of dislocation density and concentration of supersaturated vacancy. The hardness of die forging copper also dropped to some extent. The electric conductivity of die forging copper was increased by 5.2% after annealing treatment because the concentration of supersaturated vacancy and dislocation density was decreased obviously.

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Periodical:

Advanced Materials Research (Volumes 690-693)

Pages:

58-61

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.690-693.58

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Online since:

May 2013

Authors:

Gui Rong Yang, Wen Ming Song, Ying Ma, Yuan Hao

Keywords:

Annealing Treatment, Electrical Conductivity, Hardness, Microstructure, Tensile Strength

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References

[1] Wonoh L.,Sang-Bok L.,Oyoung C., Journal of Materials Science,2011,46 (7) :2359-2364

Google Scholar

[2] K. Hanazaki,N. Shigeiri, Materials Science and Engineering, 2010,527(21-22): 5699-5707

Google Scholar

[3] V. F. Kharlamov, D. A. Korostelev, Physics of the Solid State 2012,54(6):1281-1288

Google Scholar

[4] Fan, Y.,Wen, X.,Jafri, S.A.K.S., Electric Power Applications, 2012,6(3):143-148

Google Scholar

[5] M. Pietrzyk, L. Madej, CIRP Annals - Manufacturing Technology, 2010, 59(1): 319-322

Google Scholar

[6] H. Ssemakula, M. Jacobsson, Journal of Materials Processing Technology, 2006 172 (2) :264-270

Google Scholar

[7] J.X. WANG; L.H. JIANG; W.J. LI, Forging & Stamping Technology, 2010, 35(3),76-80

Google Scholar

[8] Z.X. Cui, Metal Technology and Heat Treating, China Machine press, 1997, 184-189

Google Scholar

[9] Shikov A, Pantsyrnyi V, Vorobieva A. High strength, Physica C, 2009, 354:410-414.

Google Scholar