Design of Detection System of Temperature Signal on Polishing Interface in CMP Semiconductor Material of SiC Crystal Substrate

Abstract:

The semiconductor material, SiC single crystal substrate, has been become an indispensable substrate material in the field of semiconductor lighting. In order to detect the influence of polishing interface temperature on polishing quality in chemical mechanical polishing (CMP) SiC single crystal substrate online, in this paper, according to the principle of chemical mechanical polishing, a device has been designed for detecting the polishing interface temperature in chemical mechanical polishing. AT89S52 microcontroller-based, using six 1-wire digital temperature thermometer DS18B20 to detect the temperature signal of different six locations, then to transmit out by the wireless transmission module nRF24L01 chip, and to achieve a multi-point temperature signal collection and wireless transmission. The device is simple, reliable and low cost. It will be providing a reference for temperature measurements in ultra-precision machining process online.

• Periodical: Advanced Materials Research (Volume 703)
• Pages: 287-290
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.703.287
• Online since: June 2013
• Authors: Hong Gao, Jian Xiu Su
• Keywords: Chemical Mechanical Polishing, Data Collection, SiC Single Crystal Substrate, Temperature Sensors, Wireless Transmission

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