Transient Liquid Phase Bonding of T91 Steel Using Two-Step Heating Process

Xue Gang Wang; Xin Geng Li

doi:10.4028/www.scientific.net/AMR.712-715.701

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 712-715Transient Liquid Phase Bonding of T91 Steel Using...

Transient Liquid Phase Bonding of T91 Steel Using Two-Step Heating Process

Abstract:

A novel two-step heating process, consisting of a short-time high temperature heating followed by isothermal solidification at a lower temperature, was used to transient liquid phase (TLP) bond T91 steel. The interface morphology of the joint was investigated and compared with that of conventional TLP bond made at a constant bonding temperature. The results show that the two-step heating process produces a non-planar interface at the initial stage, which is different from the planar interfaces associated with conventional heating process. No interface can be found in the final joint by two-step heating process, however, a planar interface still exists in the final conventional TLP bond. Therefore, the bending ductility of the joint is dramatically improves by the two-step heating process, and the joint properties are similar to that of base metal.

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Periodical:

Advanced Materials Research (Volumes 712-715)

Pages:

701-704

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.712-715.701

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Online since:

June 2013

Authors:

Xue Gang Wang*, Xin Geng Li

Keywords:

Interface, T91, TLP Bonding, Two-Step Heating

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References

[1] D.S. Duvall, W.A. Owczarski and D.F. Paulionis, TLP bonding: a new method for joining heat resistant alloys, welding journal. 53 (1974)203-214.

Google Scholar

[2] A.A. Shirzadi and E.R. Wallach, U.K. patent 9709167.2. (1997)

Google Scholar

[3] X.G. Wang, X.G. Li and Q. Yan, A novel bonding process: super-cooled transient liquid phase, Acta metallurgical sinica.543(2007),1096-1100.

Google Scholar

[4] C.Epelbaum, M.Fontana, F.Audebert and B.Arcondo, Joining steel tubes employing Fe-Si-B metallic glasses as filling material, Journal of materials science.40(2005) 4867-4871.

DOI: 10.1007/s10853-005-3883-6

Google Scholar

[5] X.G..Li, J.Wu, Q.Yan, X.H. Zhang and X.G. Wang, China patent 02135336.0. (2005)

Google Scholar

[6] W.D. Macdonald and T.W. Eagar, Transient liquid phase bonding, Annu Rev Mater Sci . 22(1992) 23-46.

DOI: 10.1146/annurev.ms.22.080192.000323

Google Scholar

[7] Y zhou, W.F. Gale and T.H. North, Modelling of transient liquid phase bonding,Inter Mater Rev .40(1995) 181-196.

Google Scholar

[8] W.F. Gale and D.A. Butts, Overview transient liquid phase bonding, Science and technology of welding and joining.9 (2004)283-300.

DOI: 10.1179/136217104225021724

Google Scholar

[9] A.A. Shirzadi and E.R. Wallach, Analytical modelling of transient liquid phase (TLP) diffusion bonding when a temperature gradient is imposed, Acta mater.47 (1999)3551-3560.

DOI: 10.1016/s1359-6454(99)00234-7

Google Scholar

[10] H.assadi, A.A. Shirzadi and E.R. Wallach, Transient liquid phase diffusion bonding under a temperature gradient: modeling of the interface morphology, Acta mater.49 (2001)31-39.

DOI: 10.1016/s1359-6454(00)00307-4

Google Scholar