A Simple Method TOWARDS Decapping of the MEMS and CMOS Parts for CD Measurements and Failure Analysis

Dan Dan Wang; Jeffrey Lam; Zhi Hong Mai

doi:10.4028/www.scientific.net/AMR.740.422

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 740A Simple Method TOWARDS Decapping of the MEMS and...

A Simple Method TOWARDS Decapping of the MEMS and CMOS Parts for CD Measurements and Failure Analysis

Abstract:

Decapping is very important and essential for the MEMS failure analysis. Herein, we take a simple and environment friendly method to separate the device into MEMS and CMOS parts for CD measurements and failure analysis.

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Periodical:

Advanced Materials Research (Volume 740)

Pages:

422-425

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.740.422

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Online since:

August 2013

Authors:

Dan Dan Wang, Jeffrey Lam, Zhi Hong Mai

Keywords:

Decapping, Failure Analysis, MEMS Structure

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References

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