A Novel Approach for MEMS Vacuum Packaging

Cheng Gang Wang; Zhi Yin Gan; Xue Fang Wang; Dong Lin; Sheng Liu; Hong Hai Zhang

doi:10.4028/www.scientific.net/AMR.744.169

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A Novel Approach for MEMS Vacuum Packaging
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 744A Novel Approach for MEMS Vacuum Packaging

A Novel Approach for MEMS Vacuum Packaging

Abstract:

MEMS vacuum packaging now is the impediment of the MEMS appliance in some specified fields. The major problem of current packaging approach is that the packaging process can not match the requirement of the ultra low leak. But the process now can not be improved with the existing technology. In this situation, authors proposed a novel approach for MEMS vacuum packaging, which can remarkably lower the leak rate. This paper analyzed the vacuum maintaining time of the vacuum packaging and compared the current design and new packaging method.

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Periodical:

Advanced Materials Research (Volume 744)

Pages:

169-173

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.744.169

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Online since:

August 2013

Authors:

Cheng Gang Wang, Zhi Yin Gan, Xue Fang Wang, Dong Lin, Sheng Liu, Hong Hai Zhang

Keywords:

Leak Rate, MEMS, Packaging Method, Vacuum

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