Design of Solder Alloy Composition for Semi-Flexible Coaxial Cable Holistic Tin-Plating Application

Abstract:

Holistic tin-plating on the outer conductor is one of the key processes in the manufacture of semi-flexible coaxial cable. In this study, a tin-based solder alloy was developed for this special tin-plating process. For this new solder alloy, the molten solder's antioxidant performance, the morphology of inter-metallic compounds (IMCs) at the solder/copper interface and the dissolution rate of outer conductor during tin-plating process were studied. The results indicate that when the addition of P element in the pure tin solder up to 35ppm, the static oxidation rate of pure tin decreased to 12.1g/m² from 26.5g/m², while the dynamic oxidation rate decreased from 8.9g/m² to 5.6g/m², which can significantly reduce the amounts of the oxidized slag from tinned tank during the continuous operating; By adding 0.1%Co, 0.05%Ni, the morphology of IMCs changed from scallop-shape to a uniform plate-shape, which can improve the interfacial bonding strength and flexibility; Adding 0.7%Cu can reduce the dissolution of the outer copper conductor during tin-plating process.

• Periodical: Advanced Materials Research (Volume 746)
• Pages: 434-439
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.746.434
• Online since: August 2013
• Authors: Fang Jie Cheng, Bao Xiang Wang, Ying Wang, Li Jun Yang, Yu Kun Chen
• Keywords: Antioxidant Performance, Dissolution, Holistic Tin-Plating, IMCs, Semi-Flexible Coaxial Cable, Solder Alloy

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