Fabrication of Porous Copper Layers by Two-Steps Process: Electrodeposition and Combustion

Abstract:

Porous materials have been widely used since long ago because they possess important applications: acoustic, thermal insulation, building constructions, biomaterials, aeronautical application, etc. [. The development of porous materials is based on many materials. In a topic are develop the layer of materials by copper electroplating process. It is one of the oldest protective and decorative metallic coatings for steel and other basis metals [. Therefore, intensive studies were carried out to render copper electroplating suitable for different purposes. One of the most important baths used for electroplating copper was the electrolyte bath. The organic (PEG) additives are added copper sulphate plating bath to improve the quality of the porous layer. The electrolyte bath consists of the copper sulphate and PEG particle. Colloidal suspensions are often used as templates to fabricate porous layer material [. So an increment in porosity reduces the mechanical strength of porous materials. The polymer must have good adhesion with the polymer are determine the particle size and amount in electrolyte. Based on this process electroplating was used because the atomic are orderly arrangement and the atomic are packing than other process of porous materials. In the present study we report the preparation of porous layers materials on copper substrate by the electroplating process. The electrolyte solution system used as 35 g·l^-1 Cu from CuSO₄·5H₂O in different conditions (current density and amount of PEG) and characterization of porous layer materials which process the appropriate morphology and chemical properties to be considered as feasible candidates for developing materials.

• Periodical: Advanced Materials Research (Volume 747)
• Pages: 757-760
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.747.757
• Online since: August 2013
• Authors: Wongsakorn Muthusith, Aphichart Rodchanarowan
• Keywords: Copper, Electrodeposition, Pore, Porous Material

References

[1] H. El-Sayed, M.T. Greiner, P. Kruse, Selective electroplating of copper lines on pre-patterned tantalum oxide thin films, Appl Surf Sci. 253 (2007) 8962–8968.

DOI: 10.1016/j.apsusc.2007.05.014

[2] R. Rodriguez a, M. Estevez, S. Vargas, M. Gonzalez, R. Salazar, F. Pacheco, Synthesis and characterization of HAp-based porous materials, Mater Lett. 63 (2009) 1558–1561.

DOI: 10.1016/j.matlet.2009.04.019

[3] S.S. Abd El Rehim, S.M. Sayyah, M.M. El Deeb, Electroplating of copper films on steel substrates from acidic gluconate baths, Appl Surf Sci. 165 (2000) 249–254.

DOI: 10.1016/s0169-4332(00)00015-5

[4] L. Xiangliang, W. Xibao, G. Rui, S. Li, Study of deposition patterns of plating layers in SiC/Cu composites by electro-brush plating, Appl Surf Sci. 257 (2011) 10294–10299.

DOI: 10.1016/j.apsusc.2011.07.045

[5] U. Diebold, J.M. Pan, T.E. Madey, Growth mode of ultrathin copper overlayers on TiO2 (110), Phys Rev B. 47 (1993) 3868–3876.

DOI: 10.1103/physrevb.47.3868

[6] M. Schlesinger, M. Paunovic: Modern Electroplating (2000).

[7] C.T.J. Low, R.G.A. Wills, F.C. Walsh, Electrodeposition of composite coatings containing, Surf Coat Tech. 201 (2006) 371-382.

[8] J.B. Bates, N.J. Dudney, B.J. Neudecker, F.X. Hart, H.P. Jun, S.A. Hackney, Preferred orientation of polycrystalline LiCoO2 films, J. Electrochem. 147 (2000) 59–70.

DOI: 10.1149/1.1393157