Influence of Abrasive on Planarization Polishing with the Tiny-Grinding Wheel Cluster Based on the Magnetorheological Effect

Qiu Sheng Yan; Yong Yang; Jia Bin Lu; Wei Qiang Gao

doi:10.4028/www.scientific.net/AMR.76-78.229

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 76-78Influence of Abrasive on Planarization Polishing...

Influence of Abrasive on Planarization Polishing with the Tiny-Grinding Wheel Cluster Based on the Magnetorheological Effect

Abstract:

Experiments were conducted to polish optical glass with the magnetorheological (MR) effect-based tiny-grinding wheel cluster, and the influences of abrasive material, particle size and content on the material removal rate and surface roughness are investigated. The experimental results indicate that: the higher the hardness of abrasives, the higher the material removal rate, but the abrasives with lower hardness can obtain lower surface roughness. The better polishing quality of the workpiece can be obtained when the particle size of abrasives is similar to the particle size of magnetic particles. Moreover, the content of abrasives has an optimum value, and the material removal rate and the surface quality can not be improved further when the content of abrasives exceeds the optimum value. On the basis of above, the material removal model of the new planarization polishing technique is presented.

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Periodical:

Advanced Materials Research (Volumes 76-78)

Pages:

229-234

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.76-78.229

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Online since:

June 2009

Authors:

Qiu Sheng Yan, Yong Yang, Jia Bin Lu, Wei Qiang Gao

Keywords:

Magnetorheological Effect, Material Removal, Semi-Bounded Abrasives, Tiny-Grinding Wheel Cluster

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