Trusted Class Measurement Module - A Novel Fine-Grained Integrity Measurement Method for Java Application

Hai He Ba; Song Zhu  Mei; Jiang Chun Ren; Zhi Ying Wang; Yong  Cheng; Huai Zhe  Zhou

doi:10.4028/www.scientific.net/AMR.760-762.1100

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 760-762Trusted Class Measurement Module - A Novel...

Trusted Class Measurement Module - A Novel Fine-Grained Integrity Measurement Method for Java Application

Abstract:

typically, integrity measurement technology for Java application is based on the whole file, which is too coarse to meet different requirements. In this paper, we propose a novel fine-grained integrity measurement method for Java application: trusted class measurement module (TCMM), which is a class integrity measurement method according to organization structure of Java application file. It not only satisfies necessary trust but also has less impact on system performance.

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Periodical:

Advanced Materials Research (Volumes 760-762)

Pages:

1100-1105

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.760-762.1100

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Online since:

September 2013

Authors:

Hai He Ba, Song Zhu Mei, Jiang Chun Ren, Zhi Ying Wang, Yong Cheng, Huai Zhe Zhou

Keywords:

Fine-Grained Integrity Measurement, Organization Structure, System Performance

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