High-Accuracy Calibration of the Wheel Spindle Tilt Angle for Grinding Hydrostatic Seal Rings Used in Reactor Coolant Pumps

Article Preview

Abstract:

The hydrostatic seal rings are one of the most important components used in reactor coolant pumps. They are generally made of hard materials such as silicon nitride, alumina, silicon carbide and tungsten carbide. Meanwhile, the form error should be within the length of one to two helium light bands and the surface roughness should be in the scale of nanometers, which make them difficult to machining. In order to solve this problem, a high accuracy grinding method using a large cup wheel had been proposed and the tilt angle of the cup wheel spindle become a crucial factor affecting the ground form errors. This paper addresses a novel method for high-accuracy calibrating the tilt angle of the cup wheel spindle to fit the extremely shallow taper angle of the seal ring conical surface, and the mathematical model is established incorporating a standard optical flat with a high-accuracy laser displacement sensor. The practicability of this method is verified by grinding a seal ring sample with the outer diameter is 200 mm and the taper angle is 700 μrad. It is found that the taper angle error is only 1.72 μrad and the radical profile error of the conical surface is about 0.22 μm.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

140-145

Citation:

Online since:

September 2013

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2013 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] Groudev, P., and Stefanova, A. Validation of RELAP5/MOD3. 2 Model on Trip off One Main Coolant Pump for VVER 440/V230. Nuclear Engineering and Design, 2006, 236, pp: 1275-1281.

DOI: 10.1016/j.nucengdes.2005.11.011

Google Scholar

[2] Runkel, J., Stegemann, D., and Vortriede. A. Operating Experience with an On-line Vibration Control System for PWR Main Coolant Pumps. Nuclear Engineering and Design, 1998, 183, pp: 157-167.

DOI: 10.1016/s0029-5493(98)00180-0

Google Scholar

[3] Allaire, O. E. Noncontacting Face Seals for Nuclear Applications – A Literature Review. Journal of the Society of Tribologists and Lubrication Engineers, 1984, 40, pp: 344-351.

Google Scholar

[4] Huo, F. W., Feng, G., and Guo, D. M. Ultra-precision Grinding of Conical Surfaces of Hydrostatic Mechanical Seal Rings Used in Reactor Coolant Pumps. Journal of Mechanical Engineering, 2012, 48(21), pp: 183-189. (in Chinese).

DOI: 10.3901/jme.2012.21.183

Google Scholar

[5] Feng, G., Huo, F. W., Guo, D. M., Kang, R. K. and Jin, Z. J. Ultra-precision Grinding of Asymmetric Curved Surfaces by Line Contact with Cup Wheel. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 2013, 227(1), pp: 111-119.

DOI: 10.1177/0954406212444516

Google Scholar

[6] Fan, K. C., Lee, M. Z. and Mou, J. I. On-Line Non-Contact System for Grinding Wheel Wear Measurement. International Journal of Advanced Manufacture Technology, 2002, 19(1), pp: 14-22.

DOI: 10.1007/pl00003964

Google Scholar

[7] Zhao, Y. W., Chang, L. A Micro-contact and Wear Model for Chemical–mechanical Polishing of Silicon Wafers. Wear, 2002, 252(3-4), pp: 220-226.

DOI: 10.1016/s0043-1648(01)00871-7

Google Scholar

[8] Jha, S., Jain, V. K. Design and Development of the Magnetorheological Abrasive Flow Finishing (MRAFF) Process. International Journal of Machines and Manufacture, 2004, 44(10), pp: 1019-1029.

DOI: 10.1016/j.ijmachtools.2004.03.007

Google Scholar

[9] Young L A, Key B, Philipps R, et al. Mechanical seals with laser machined wavy sic faces for high duty boiler circulation and feedwater applications. Lubrication Engineering, 2003, 59(4), pp: 30-39.

Google Scholar

[10] Feng, G., Huo, F. W., Jin, Z. J., Kang, R. K. and Guo, D. M. Implementation Strategy for High Accuracy Grinding of Conical Surfaces of Hydrostatic Seal Rings Used in Reactor Coolant Pumps. Tribology, 2013, 33(2), pp: 244-250. (in Chinese).

DOI: 10.4028/www.scientific.net/amr.797.140

Google Scholar

[11] Chen, C. C. A., and Hsu, L. S. A Process Model of Wafer Thinning by Diamond Grinding. Journal of Materials Processing Technology, 2008, 201, pp: 606-611.

DOI: 10.1016/j.jmatprotec.2007.11.243

Google Scholar

[12] Sun, W. P., Pei, Z. J., Fisher, G. R. Fine Grinding of Silicon Wafers: Machine Configurations for Spindle Angle Adjustments. International Journal of Machine Tools & Manufacture, 2005, 45, pp: 51-61.

DOI: 10.1016/j.ijmachtools.2004.06.013

Google Scholar