Dynamic Analysis of Micro Devices with Squeeze-Film Damping Effect Using Hybrid Numerical Scheme

Chin Chia Liu

doi:10.4028/www.scientific.net/AMR.811.474

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 811Dynamic Analysis of Micro Devices with...

Dynamic Analysis of Micro Devices with Squeeze-Film Damping Effect Using Hybrid Numerical Scheme

Abstract:

Using traditional methods such as perturbation theory or Galerkin approach method to analyze the dynamic response of electrostatic devices is not easy due to the complexity of the interactions between the electrostatic coupling effect, the fringing field effect, the residual stress, the nonlinear electrostatic force and squeeze-film damping effect. Accordingly, the present study proposes a new approach for analyzing the dynamic response of such devices using a hybrid numerical scheme comprising the differential transformation method and the finite difference method by pure DC or combined DC / AC loading. The validity of the proposed scheme is confirmed by comparing the results obtained for the pull-in voltage of the micro-beam with those presented in the literature derived using a variety of schemes. Overall, the results show that the hybrid numerical scheme provides a suitable means of analyzing the nonlinear dynamic behavior of a wide variety of common electrostatically-actuated microstructures.

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Periodical:

Advanced Materials Research (Volume 811)

Pages:

474-477

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.811.474

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Online since:

September 2013

Authors:

Chin Chia Liu

Keywords:

Fixed-Fixed Micro-Beam, MEMS, Pull-In Voltage, Reynolds Equation, Squeeze Film Damping Effect

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References

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