High Temperature Deformation and Creep Behaviors of Directionally Solidified (DS) Inconel 738LC Crystals

Abstract:

In this study high temperature deformation and creep behaviors of DS IN738LC were studied. The yield strength and the total elongation decreased gradually with increase of temperature from room temperature to 500°C. The tensile strength and ductility increased rapidly with increase of temperature from 500°C to 660°C. The flow stress of Inconel738LC increases with increasing temperature up to about 600°C in the presence of γ precipitates. For high temperature creep, the stress exponent was observed to increase from 3~9 in the lower stress region to 13~16 in the higher stress region. The significant change of the stress exponent is likely to be attributed to the inverse temperature dependence of flow stress at high temperatures in directionally solidified IN738LC.

• Periodical: Advanced Materials Research (Volume 813)
• Pages: 112-115
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.813.112
• Online since: September 2013
• Authors: Jong Su Ha, Seong Uk An, Pyung Woo Shin, Sun Ig Hong
• Keywords: Creep, Directionally Solidified, Hot Tensile Test, Inconel

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