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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 815Wettability of Sn-Zn Lead-Free Solder on Aluminum...

Wettability of Sn-Zn Lead-Free Solder on Aluminum Substrate

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Abstract:

The effects of flux components and compositions of solder alloys on the wettability of the Sn-Zn alloys on aluminum surface was investigated. The results show that the wettability of the Sn-9Zn solder on aluminum substrate improved with flux of double solvents composed of diethanolamine and triethanolamine, which is better than single solvent. When flux is composed of 3% zinc fluoborate as activator and 30% triethanolamine plus 67% diethanolamine as double solvents, the spreading area of the Sn-9Zn solder reaches to 75%. Trace addition (0.002%-0.005%) of Al results in significant improvement of the wettability of the Sn-9Zn based solder. However, additions of Bi or Sb are not beneficial to the wettability of the solder on aluminum substrate.

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Progress in Materials Science and Engineering: ICMSE 2013

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Periodical:

Advanced Materials Research (Volume 815)

Pages:

48-54

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.815.48

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Online since:

October 2013

Authors:

Xiao Yan Xu, Guo Tong Qian, Jian Zhou, Yao Yao, Xu Chen

Keywords:

Aluminum (Al), Flux, Lead-Free Solder, Sn-Zn Alloy, Wettability

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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