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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 834-836Research Development of AuSn20 Solder Preparation...

Research Development of AuSn20 Solder Preparation Technology

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Abstract:

With the development of miniaturization and lead free of electronic products, high demand is put forward about solder. AuSn20 lead free solder is widely used in high reliable hermetic package and die welding due to excellent mechanical property. This paper described the proper ties and preparation technology of AuSn20 solder, pointed out the disadvantages of the conventional drawing and rolling process, casting process and laminose composite process of cold rolling, put out improvement of study method and the preparation technology, investigate and develop the new forming technology for preparing AuSn20 low temperature eutectic solder, will achieve the solid basis for the large-scale production of this material.

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Research in Materials and Manufacturing Technologies

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Periodical:

Advanced Materials Research (Volumes 834-836)

Pages:

803-807

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.834-836.803

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Online since:

October 2013

Authors:

Jie Qiong Hu*, Ming Xie, Ji Ming Zhang, Man Men Liu, Yong Tai Chen, You Cai Yang

Keywords:

AuSn20 Solder, Lead-Free, Microstructure, Preparation Method, Thermal Conductivity (TC)

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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