Effect of Solder Volume on Interfacial Reaction between SAC405 Solders and EN(B)EPIG Surface Finish

Abstract:

The electronic packaging industry is now being driven towards smaller, lighter, and thinner electronic products but with higher performance and more functions. Thus, smaller solder ball sizes are needed for fine solder joint interconnections to fulfill these requirements. This study investigates the interfacial reactions during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405) and electroless nickel (boron)/ immersion palladium/immersion gold (EN(B)EPIG). Reliability of solder joint has also been investigated by performing solid state isothermal aging at 125 °C for up to 2000 hours. The results revealed that after reflow soldering, (Cu, Ni)₆Sn₅ IMC is formed between solder and substrate while after aging treatment another IMC was found between (Cu, Ni)₆Sn₅ and substrate known as (Ni, Cu)₃Sn_4. Aging time of solder joints resulted in an increase in IMC thickness and a change in morphology into more spherical, dense and with larger grain size. By using optical microscope, the average thickness of the intermetallics was measured and it found that the larger solder balls produced thicker IMC than the smaller solder balls during reflow soldering. However, after aging the smaller solders produced thicker IMC than the larger solders.

• Periodical: Advanced Materials Research (Volume 845)
• Pages: 76-80
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.845.76
• Online since: December 2013
• Authors: Saliza Azlina*, Ali Ourdjini, Astuty Amrin, Idris Siti Rabiatull Aisha
• Keywords: Intermetallic Compound, Isothermal Aging, Lead-Free Solder, Soldering, Surface Finish

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