Combined Reliability Testing Profile Model and Application for Embedded System

Jin Hui Wang; Jun Ai; Lin Zhi Huang

doi:10.4028/www.scientific.net/AMR.846-847.587

Paper Titles

Study on the Design and the Stability of Integrated Quartz Resonator
p.569

Study the Fisheye Staring Video Surveillance System of nothing Blind-Zone Based on the DaVinci Chip
p.574

The Research and Design of Overhead Transmission Line Temperature Monitoring Technology Based on ZigBee
p.578

Realization of SVPWM Controller Based on FPGA
p.583

Combined Reliability Testing Profile Model and Application for Embedded System
p.587

Research of Anti-Multipath Interference Capability in Direct Sequence Spread Spectrum Communication System by Simulation
p.592

Electromagnetic Vibration Test of Reactor with Inverter Power Supply
p.596

Optimization Based on Frequency and Driving Voltage Control for Wireless Power Transmission System
p.603

Linear Boundary of Current Closed-Loop Control of Two-Quadrant H-Half Bridge Converter in Excitation System
p.607

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 846-847Combined Reliability Testing Profile Model and...

Combined Reliability Testing Profile Model and Application for Embedded System

Abstract:

Embedded system is applied more and more extensively in the fields of national defense weapon equipment. With the increasing complexity of embedded systems, the combination of the hardware with software is more and closer. Because of the overall characteristic of hardware and software combination in embedded system, traditional reliability test can hardly accurately identify the reliability of embedded systems. The proposed combined reliability testing method, which combines software reliability test with system integrated environmental stress test to simulate the state of system running, provides the basis for the accurate validation and evaluation of reliability of embedded system.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 846-847)

Pages:

587-591

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.846-847.587

Citation:

Cite this paper

Online since:

November 2013

Authors:

Jin Hui Wang*, Jun Ai, Lin Zhi Huang

Keywords:

Combined Reliability Testing, Embedded System, Reliability

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] Jinhee, P., et al. An Embedded Software Reliability Model with Consideration of Hardware Related Software Failures. in Software Security and Reliability (SERE), 2012 IEEE Sixth International Conference on. (2012).

DOI: 10.1109/sere.2012.10

Google Scholar

[2] Iyer, R.K. and P. Velardi, Hardware-Related Software Errors: Measurement and Analysis. Software Engineering, IEEE Transactions on, 1985. SE-11(2): pp.223-231.

DOI: 10.1109/tse.1985.232198

Google Scholar

[3] Bing, H., et al., Hardware Error Likelihood Induced by the Operation of Software. Reliability, IEEE Transactions on, 2011. 60(3): pp.622-639.

Google Scholar

[4] COSTIND, Reliability Qualification and Acceptance Test. (2009).

Google Scholar

[5] USA, D.O.D., Handbook for Reliability Test Methods, Plans, and Environments for Engineering, Development Qualification, and Production. (1996).

Google Scholar

[6] Musa, J.D. The operational profile in software reliability engineering: an overview. in Software Reliability Engineering, 1992. Proceedings., Third International Symposium on. (1992).

DOI: 10.1109/issre.1992.285850

Google Scholar

[7] JA, W. and P. JH, Markov analysis of software specifications. 1994. 2(01): pp.93-106.

Google Scholar

[8] Qi, A., et al. Scenario-based software operational profile. in Reliability, Maintainability and Safety (ICRMS), 2011 9th International Conference on. (2011).

DOI: 10.1109/icrms.2011.5979355

Google Scholar