Optimization of HTPB-Bonding System Used for High-Solid-Containing PBX Based on Properties of Materials

Yong Jiang Wei; Geng Guang Xu; Qiu An Huang; Xue Mei Liu

doi:10.4028/www.scientific.net/AMR.848.141

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 848Optimization of HTPB-Bonding System Used for...

Optimization of HTPB-Bonding System Used for High-Solid-Containing PBX Based on Properties of Materials

Abstract:

The HTPB-bonding system used for high-solid-containing PBX was optimizied by orthogonal experiment,and three major factors that were viscosity,hardness and curing time were confirmed as mian indexes for measuring properties of bonding system.The optimal variation range for viscosity,hardness and curing time was respectively 100~125 s,20~28 HC and 4~6 days.Through fitting experimental data,the equations of these three indexes were obtained and then changing laws of that were also studied.By sovling these equations,the best values of constitutions were obtained and formulations for bonding system with different plasticizers were optimized.

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Periodical:

Advanced Materials Research (Volume 848)

Pages:

141-145

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.848.141

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Online since:

November 2013

Authors:

Yong Jiang Wei*, Geng Guang Xu, Qiu An Huang, Xue Mei Liu

Keywords:

Bonding System, High-Solid Content, Hydroxyl-Terminated Polybutadiene (HTPB), Orthogonal Optimization, Physical Chemistry

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