A Study of Reaction Viscosity Changes in Electronic Packaging with Different Nanoparticle Strengthened Epoxy Matrices

Huey Ling Chang; Chih Ming Chen; Cheng Ho Chen

doi:10.4028/www.scientific.net/AMR.853.23

Paper Titles

Effect of Polymeric Combinations on Mucoadhesive and Swelling Properties of Orabase Gel Formulations
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Power Law and Stretched Exponential Responses in Composite Solids
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Facile Synthesis and Optical Properties of TiN/Al Composite Powders with Nano/Microstructure by Ball-Milling Method
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A Study of Reaction Viscosity Changes in Electronic Packaging with Different Nanoparticle Strengthened Epoxy Matrices
p.23

The Effects of Chemical Resistance for Nanocomposite Materials via Nano-Silica Addition into Glass Fiber/Epoxy
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Influences of Nano-Silica Addition on Diluent/Epoxy Mechanical Properties
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Effects of Nano-Silica Addition on Water Absorption of Glass Fiber/Epoxy Composite
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Effects of Nano-Silica Addition and Reactive Diluent Addition on Dynamic Mechanical Properties of Epoxy Nanocomposites
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 853A Study of Reaction Viscosity Changes in...

A Study of Reaction Viscosity Changes in Electronic Packaging with Different Nanoparticle Strengthened Epoxy Matrices

Abstract:

In this paper, the effects of strengthening epoxy matrices with nanopowders are discussed. Investigate the changes of reaction viscosities after adding different hardeners, nanoparticles and diluents to the polymer matrices. Analyze the applications to the automatic electronic packaging. The results show that different species in the curing reaction systems of epoxy will affect flow stabilities. Reaction viscositiesare affected primarily by the choice of hardeners. Nanoparticles will increase system viscosities and shorten matrix resin gel time. Adding diluents will help spread the powders and material flows in the systems, but is relatively not good for stability.

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Periodical:

Advanced Materials Research (Volume 853)

Pages:

23-27

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.853.23

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Online since:

December 2013

Authors:

Huey Ling Chang*, Chih Ming Chen, Cheng Ho Chen

Keywords:

Electronic Packaging, Nanocomposite, Nanoparticle, Reaction Viscosity

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