Microstructural Study of Sn-3.0Ag0.5Cu Alloy on Cu/NiP-Coated Substrate by Addition of Fe, Sb and Ce

Abstract:

In this study, the effects of alloying elements Fe (0.2 wt.%), Sb (0.5 wt.%) and Ce (0.5 wt.%) on the Sn-3.0Ag-0.5Cu lead-free solder system were investigated. The solder alloy was reflowed on electroless Cu/NiP-coated substrates and their behavior such as microstructure, wetting angle and intermetallic compound (IMC) formation were analyzed. The results showed that the presence of Fe, Ce and Sb reduced the grain size of β-Sn as compared to solder without addition of alloying element. The addition of Fe and Ce was the most significantly refined the microstructure of Sn-3.0Ag-0.5Cu solder alloys. Sn3.0Ag0.5Cu0.2Fe0.5Ce solder was revealed better spreading behavior on Cu/NiP coated substrates which have the lowest IMC thickness of 0.558 μm.

• Periodical: Advanced Materials Research (Volume 858)
• Pages: 116-121
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.858.116
• Online since: November 2013
• Authors: Abu Seman Anasyida, Mohd Sharif Nurulakmal, Mahani Yusoff, Chia Li Teh
• Keywords: Alloying Element, Cu-NiP Coated Substrate, Lead Free Solder, Microstructure

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