A Novel Plasma-Chemical Process of Metallic Layer Deposition From Small-Size Volatile Metal Complexes

Abstract:

Metallic copper ultra-thin layers were synthesized by modified PE CVD method from low-sized volatile metal complexes consisting of small (2- to 5atomic) ligand molecules. To characterize the deposited copper layers the X-ray photoelectron (XPS), infrared (FTIR) and UV-vis spectroscopy, SEM, XRD analyses were used. The layers were found to be nanocrystalline and have a nanoscale grain structure with parameters depending on the experimental conditions. It was revealed that plasma activation decreases mean size of copper grains and increases its stability on the air. The microstructure of the layers was examined by scanning electron microscopy (SEM) and diffraction of synchrotron radiation (DSR) methods, and chemical composition with a predominant content of copper in the metallic state Cu0.

• Periodical: Advanced Materials Research (Volumes 875-877)
• Pages: 246-250
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.875-877.246
• Online since: February 2014
• Authors: Maxim S. Polyakov, Aram M. Badalyan, Vasily V. Kaichev, Igor K. Igumenov
• Keywords: Copper Films, Metal Layer Deposition, Nano-Sized Layers, Nanotechnology, Technological Device Equipment, Thin Coating

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