[1]
S. Iijima, Helical microtubules of graphitic carbon, Nature. 354 (1991) 56-58.
DOI: 10.1038/354056a0
Google Scholar
[2]
Y. Feng, H. Yuan, Electroless plating of carbon nanotubes with silver, J. Mater. Sci. 39 (2004) 3241-3243.
DOI: 10.1023/b:jmsc.0000025869.05546.94
Google Scholar
[3]
F. Z. Kong, X. B. Zhang, W. Q. Xiong, F. Liu, W. Z. Huang, Y. L. Sun, J. P. Tu, X. W. Chen, Continuous Ni-layer on multiwall carbon nanotubes by an electroless plating method, Sure. Coat. Tech. 155 (2002) 33-36.
DOI: 10.1016/s0257-8972(02)00032-4
Google Scholar
[4]
E. Dujardin, T. W. Ebbesen, H. Hiura, K. Tanigaki, Capillarity and wetting of carbon nanotubes, Science. 265 (1994) 1850-1852.
DOI: 10.1126/science.265.5180.1850
Google Scholar
[5]
T. Yamamoto, K. I. Tsubone, Assembly technology using lead-free solder, J. FUJITSU Sci. Tech. 43 1 (2007) 50-58.
Google Scholar
[6]
Z. F. Yuan, K. Mukai, K. Takagi, M. Ohtaka, W. L. Huang, Q. S. Liu, Surface tension and its temperature coefficient of molten tin determined with the sessile drop method at different oxygen partial pressures, J. Colloid. Interf. Sci. 254, (2002).
DOI: 10.1006/jcis.2002.8589
Google Scholar
[7]
F. Z. Kong, X. B. Zhang, W. Q. Xiong, F. Liu, W. Z. Huang, Y. L. Sun, J. P. Tu, X. W. Chen, Continuous Ni-layer on multiwall carbon nanotubes by an electroless plating method, Surf. Coat. Tech. 155 (2002) 33-36.
DOI: 10.1016/s0257-8972(02)00032-4
Google Scholar
[8]
C. Xu, G. Wu, Z. Liu, D. Wu, T. T. Meek, Q. Han, Preparation of copper nanoparticles on carbon nanotubes by electroless plating method, Mater. Res. Bull. 39 (2004) 1499-1505.
DOI: 10.1016/j.materresbull.2004.04.021
Google Scholar
[9]
X. Ma, X. Li, N. Lun, S. Wen, Synthesis of gold nano-catalysts supported on carbon nanotubes by using electroless plating technique, Mater. Chem. Phys. 97 (2006) 351-356.
DOI: 10.1016/j.matchemphys.2005.08.026
Google Scholar
[10]
Y. Feng, H. Yuan, Electroless plating of carbon nanotubes with silver, J. Mater. Sci. 39 (2004) 3241-3243.
DOI: 10.1023/b:jmsc.0000025869.05546.94
Google Scholar
[11]
S. Chantaramanee, S. Wisutmethangoon, L. Sikong, T. Plookphol, Wettability of carbon nanotubes with molten Sn-Ag-Cu solder alloy, Appl. Mech. Mater. 372 (2013) 136-142.
DOI: 10.4028/www.scientific.net/amm.372.136
Google Scholar
[12]
S. Chantaramanee, S. Wisutmethangoon, L. Sikong, T. Plookphol, Development of a lead-free composite solder from Sn–Ag–Cu and Ag-coated carbon nanotubes, J. Mater Sci: Mater Electron. 24 (2013) 3707-3715.
DOI: 10.1007/s10854-013-1307-y
Google Scholar
[13]
Y. Peng, Q. Chen, Ultrasonic-assisted fabrication of highly dispersed copper/multi-walled carbon nanotube nanowires, Colloid. surface. A. 342 (2009) 132-135.
DOI: 10.1016/j.colsurfa.2009.04.030
Google Scholar
[14]
B. Zhao, B. L. Yadian, Z. J. Li, P. Liu,Y. F. Zhang, Improvement on wettability between carbon Nanotubes and Sn, Surf. Eng. 25 1 (2009) 31-35.
DOI: 10.1179/026708408x334104
Google Scholar
[15]
Z. C. Wang, D. D. Zhao, G. Y. Zhon, Ultrasonic assisted polyol synthesis of highly dispersed Pt/MWCNT electrocatalyst for methanol oxidation, J. Solid. State. Electrochem. 13 (2009) 371-376.
DOI: 10.1007/s10008-008-0558-7
Google Scholar