Research on Warpage of the Microfluidic Chip in Injection Molding Process

Abstract:

Reducing volumetric warpage during the injection molding process is a challenging problem in the production of microfluidic chips, as the warpage directly affects the bonding quality of the substrate and the cover sheet. In this study, the injection molding of substrate and the cover sheet, composed of PolymethylMethacrylate(PMMA), was simulated. The effect of different process parameters, holding pressure, holding time, mould temperature and injection speed, were investigated via single factor experiments, observing the warpage of the sheet with Three-Coordinate Measuring Machine. The analysis showed that the warpage was affected by non-uniform shrinkage and residual stress of the melt. Holding pressure and holding time had a greater effect on the warpage than the mould temperature and injection speed did. Therefore, reasonable holding pressure and holding time can effectively reduce the warpage of microfluidic chips in the injection molding process.

• Periodical: Advanced Materials Research (Volumes 926-930)
• Pages: 345-348
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.926-930.345
• Online since: May 2014
• Authors: Lai Yu Zhu, Chun Peng Chu, Bing Yan Jiang*
• Keywords: Injection Molding, Microfluidic Chip, Process Parameter, Warpage

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