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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 937A Study on Relationship between Orientation...

A Study on Relationship between Orientation Evolution and Coarsening Behavior of Cu₆Sn₅ Grains Formed on Polycrystalline Cu Substrate

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Abstract:

The coarsening behavior of Cu₆Sn₅ grains formed at the Sn37Pb/Polycrystalline Cu interface is investigated in terms of their orientation evolution during solid-state aging. The results show that the coarsening behavior of the interfacial Cu₆Sn₅ grains during solid-state aging are quite different from that during liquid-state soldering. The occurrence of the coarsening in the solid-sate reaction is caused by the different surface energies between two adjacent grains. In addition, the texture morphologies of the interfacial grains affect their coarsening rates. In particular, the interfacial Cu₆Sn₅ grains formed at 200 oC exhibit a texture with the [0001] direction normal to the interface after 16 days of aging at 150 oC, and the formation of this texture accelerates the coarsening process of the interfacial Cu₆Sn₅ grains.

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Periodical:

Advanced Materials Research (Volume 937)

Pages:

64-69

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.937.64

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Online since:

May 2014

Authors:

Ming Yang, Xin Ma, Ming Yu Li*

Keywords:

Coarsening, Crystal Orientation, Interfacial Reaction, Polycrystalline Cu

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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