For Libraries For Publication Open Access Downloads About Us Contact Us
Paper Titles
Experimental Research on Coaxial Extrusion of GF/Pb Complex Wire
p.85
Numerical Simulation of Push-Bending Process of Aluminum Section Profile
p.90
The Effect of Entrance Temperature on Texture and Microstructure Development in Cold Mill Rolled 85/15 α-Brass
p.96
Numerical Simulation and Process Test for Cold Extrusion of Wheel Hub Bearing Rings
p.100
Effect of Bonding Pressure on Transient Liquid Phase Bonding Joint Microstructure and Properties of T91/12Cr2MoWVTiB
p.107
Finite Element Simulation of Backward Ball Spinning of Thin-Walled Tube with Longitudinal Inner Ribs
p.111
On Spontaneous Austenite Recrystallization of Low Pressure Rotor Steel 26Cr2Ni4MoV
p.116
Research on Intelligent Deep Drawing Technology of Sheet Metal
p.120
New Methodologies for the Determination of Precise Forming Limit Curve in Single Point Incremental Forming Process
p.126

Effect of Bonding Pressure on Transient Liquid Phase Bonding Joint Microstructure and Properties of T91/12Cr2MoWVTiB

Article Preview

Abstract:

T91/12Cr2MoWVTiB was bonded by transient liquid phase bonding process with different pressures, one commercial FeNiCrSiB was used as the interlayer. The microstructure and components distribution of the bonded joints were examined by optical microscope and scanning electron microscopic techniques. Furthermore, the properties of the joints were also tested. The results indicate that with the increase of the pressure – from 2 MPa to 6 MPa – the microstructures and mechanical properties were improved, and more similar to those base alloys. A theoretical study also revealed that the isothermal solidification complication time can be shorter, because the maximum liquid width was reduced with the existence of pressure.

You might also be interested in these eBooks
Manufacturing Science and Engineering I View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 97-101)

Pages:

107-110

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.97-101.107

Citation:

Cite this paper

Online since:

March 2010

Authors:

Si Jie Chen, Si Jing Guo, Feng Liang

Keywords:

Bonding Pressure, Isothermal Solidification, Mechanical Property, Microstructure Property, T91/12Cr2MoWVTiB, Transient Liquid Phase (TLP) Bonding

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2010 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] M. Pouranvari, A. Ekrami and A.H. Kokabi： Journal of Alloys and Compounds. Vol. 461 (2008), p.641.

Google Scholar

[2] V. G. Krishnardula, N. I. Sofyanwilam: Metallurgical and Materilals Transactions A . Vol. 37A (2006), p.497.

Google Scholar

[3] E. Lugscheider, K. Bobzin and M. Maes: Surface & Coatings Technology. Vol. 200 (2005), p.444.

Google Scholar

[4] J.D. Sugara, J.T. McKeowna and T. Akashia: Journal of the European Ceramic Society. Vol. 26 (2006), p.363.

Google Scholar

[5] J.H. Huang, Y. Wan and H. Zhang : J Mater Sci . Vol. 42 (2007), p.9746.

Google Scholar

[6] W. F. Gale, Y. Guan: Journal of Materials Science. Vol. 32 (1997), p.357.

Google Scholar

[7] J.D. Liu, T. Jin, W. Li : Journal of Alloys and Compounds. Vol. 457 (2008) , p.185.

Google Scholar

[8] D.S. Duvall, W.A. Owczrski and D.F. Paulonis. Welding Journal. Vol. 53 (1974), p.203.

Google Scholar

[9] K. Tokoro, N.P. Wikstrom and O.A. Ojo: Materials Science and Engineering A. Vol. 477 (2008) , p.311.

Google Scholar

© 2025 Trans Tech Publications Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For open access content, terms of the Creative Commons licensing CC-BY are applied.
Scientific.Net is a registered trademark of Trans Tech Publications Ltd.