Neural Network Based Computer-Aided Process Design System for Wire Bonding Quality Improvement

Jian Gao; Chuan Wei Li; Ke Tian Li; Ze Xiang Li; Xin Chen

doi:10.4028/www.scientific.net/AMR.97-101.2496

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 97-101Neural Network Based Computer-Aided Process Design...

Neural Network Based Computer-Aided Process Design System for Wire Bonding Quality Improvement

Abstract:

The relationship between the process parameters and bonding quality is very complicated due to the features of non-linear and coupling relation. It’s therefore hard to express their relationship in an exact mathematic model and very difficult to obtain an reasonable parameters setting to get high bonding quality. In this paper, a wire bonding process model based on BP(Back Propagation) neural network is proposed, and based on this model a computer-aided process design system for bonding quality improvement is developed through VC++6.0. Based on the training data from design of experiments (DoE), the BP network is built. The system is validated by test data and the testing result shows that the predicted error is samll and reasonable and the system developed can be used for parameter optimization and quality improvement.

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Periodical:

Advanced Materials Research (Volumes 97-101)

Pages:

2496-2499

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.97-101.2496

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Online since:

March 2010

Authors:

Jian Gao, Chuan Wei Li, Ke Tian Li, Ze Xiang Li, Xin Chen

Keywords:

Bonding Quality, BP Neural Network (BPNN), Computer-Aided Process Design, Process Parameter, Wire Bonding

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