The Effect of Electroless Plating Time on the Coating Performance of SiC Powders

Ming Hu; Yun Long Zhang; Jing Gao; Lin Shan; Li Li Tang

doi:10.4028/www.scientific.net/AMR.971-973.204

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 971-973The Effect of Electroless Plating Time on the...

The Effect of Electroless Plating Time on the Coating Performance of SiC Powders

Abstract:

In order to improve the interface bonding condition between Cu and SiC powders, electroless copper plating was applied to deposit a Cu coating on SiC powder. The surface morphology of the SiC powder with uncoated and coated copper were investigated. The results showed that the appropriate electroless plating time was necessary for the SiC_p with uniform copper-coating. The SiC_p/Cu composites were fabricated by hot-press sintering technology. The coated-copper SiC_p were uniformly distributed in copper matrix. Key words: Electroless plating, Cu/SiC_p composites, Metal coating

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Periodical:

Advanced Materials Research (Volumes 971-973)

Pages:

204-207

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.971-973.204

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Online since:

June 2014

Authors:

Ming Hu, Yun Long Zhang, Jing Gao*, Lin Shan, Li Li Tang

Keywords:

Cu/SiC_p Composites, Electroless Plating, Metal Coating

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* - Corresponding Author

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