Study on Curing Kinetics of MEP-15/593/660 System

Jia Le Song; Chan Chan Li; Zhi Mi Zhou; Chao Qiang Ye; Wei Guang Li

doi:10.4028/www.scientific.net/AMR.988.31

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 988Study on Curing Kinetics of MEP-15/593/660 System

Study on Curing Kinetics of MEP-15/593/660 System

Abstract:

Curing kinetics of MEP-15/593 system and MEP-15/593/660 system is studied by means of differential scanning calorimetry (DSC). Curing kinetic parameters are evaluated and the relationship between diluent 660 and the curing properties is investigated. The results show that the diluent 660 can not only reduce viscosity and activation energy, but also improve the degree of cure and conversion ratio.

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Periodical:

Advanced Materials Research (Volume 988)

Pages:

31-35

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.988.31

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Online since:

July 2014

Authors:

Jia Le Song*, Chan Chan Li, Zhi Mi Zhou, Chao Qiang Ye, Wei Guang Li

Keywords:

Curing Kinetics, DSC, Epoxy Resin

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