Al-1%Si/TiN/Ti: Electromigration
a.388
a.388
Al-Si-Cu: Electromigration
a.389
a.389
(Al,Ti)91Cr9, (Al,Ti)91Cu9, (Al,Ti)91Ni9: Dislocations
a.390
a.390
Al51Ti47Mn2: Dislocations
a.391
a.391
Au: Ion Implantation and Point Defects
a.392
a.392
Au: Surface Reconstruction
a.393
a.393
Au-Cu: Interdiffusion
a.394
a.394
Au-26.5at%Pt: Dislocations
a.395
a.395
Be, Fe-Cr-Ni (AISI316L, MANET), Mo, Mo- (TZM), V, W: T Permeation
a.396
a.396
Au: Ion Implantation and Point Defects
Page: A392