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Abstracts
Relative Tangential Translation along Grain Boundaries and Grain Rotation
a.479
Nanostructures in Metallic Materials with Low Stacking Fault Energy
a.480
Deformation Mechanism Transitions in Nanoscale FCC Metals
a.481
Grain-Boundary Interfaces and Void Interactions
a.482
Twinning and Slip in Low Stacking-Fault Energy Metals
a.483
Twins, Microbands, Grain Size Effects and Shear Bands
a.484
Energy of Triple Junction Defects Due to Finite-Length Grain Boundaries
a.485
Influencing Grain Boundary Properties by Mechanical Stress
a.486
Decay of Low-Angle Tilt Boundaries in Deformed Nanocrystalline Materials
a.487
HomeDefect and Diffusion ForumDefects and Diffusion in MetalsAn Annual...Twinning and Slip in Low Stacking-Fault Energy...

Twinning and Slip in Low Stacking-Fault Energy Metals

Page: A483

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