Growth Kinetics of the Intermetallic Phases in the Cu/In-Bi 22at.%/Cu Interconnection

Abstract:

Article Preview

Info:

Periodical:

Defect and Diffusion Forum (Volumes 237-240)

Edited by:

M. Danielewski, R. Filipek, R. Kozubski, W. Kucza, P. Zieba, Z. Zurek

Pages:

1188-1192

DOI:

10.4028/www.scientific.net/DDF.237-240.1188

Citation:

J. Wojewoda et al., "Growth Kinetics of the Intermetallic Phases in the Cu/In-Bi 22at.%/Cu Interconnection", Defect and Diffusion Forum, Vols. 237-240, pp. 1188-1192, 2005

Online since:

April 2005

Export:

Price:

$35.00

In order to see related information, you need to Login.