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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 237-240Growth Kinetics of the Intermetallic Phases in the...

Growth Kinetics of the Intermetallic Phases in the Cu/In-Bi 22at.%/Cu Interconnection

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Diffusion in Materials - DIMAT2004

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Periodical:

Defect and Diffusion Forum (Volumes 237-240)

Pages:

1188-1192

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.237-240.1188

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Online since:

April 2005

Authors:

Joanna Wojewoda, Paweł Zięba, Anna Wierzbicka

Keywords:

Diffusion Soldering, Growth Rate Constant, Intermetallic Phase

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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