Atomic Diffusion Features in Au/Al & Al/Ni Bonding Interface

Abstract:

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Vertical section features in bonding point were produced by ion-sputter thinning, and were tested by using TEM-F30. Lift-off characteristics at the interface of Ultrasonic bond are observed by using SEM (JSM-6360LV). Results show that thickness of Au/Al atomic diffusion interface was about 500 Nanometer under ultrasonic and thermal energy. Ultrasonic vibration activates dislocations at metal crystal lattice. Fracture morphology of lift-off interface was dimples. Tensile fracture appeared by pull-test not in bonded interface but in basis material, and bonded strength at interface was enhanced by diffused atom from the other side.

Info:

Periodical:

Defect and Diffusion Forum (Volumes 247-248)

Edited by:

David J. Fisher

Pages:

29-0

DOI:

10.4028/www.scientific.net/DDF.247-248.29

Citation:

J. H. Li et al., "Atomic Diffusion Features in Au/Al & Al/Ni Bonding Interface", Defect and Diffusion Forum, Vols. 247-248, pp. 29-0, 2005

Online since:

December 2005

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Price:

$35.00

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