Atomic Diffusion Features in Au/Al & Al/Ni Bonding Interface

Abstract:

Vertical section features in bonding point were produced by ion-sputter thinning, and were tested by using TEM-F30. Lift-off characteristics at the interface of Ultrasonic bond are observed by using SEM (JSM-6360LV). Results show that thickness of Au/Al atomic diffusion interface was about 500 Nanometer under ultrasonic and thermal energy. Ultrasonic vibration activates dislocations at metal crystal lattice. Fracture morphology of lift-off interface was dimples. Tensile fracture appeared by pull-test not in bonded interface but in basis material, and bonded strength at interface was enhanced by diffused atom from the other side.

• Periodical: Defect and Diffusion Forum (Volumes 247-248)
• Pages: 29-0
• DOI: https://doi.org/10.4028/www.scientific.net/DDF.247-248.29
• Online since: December 2005
• Authors: Jun Hui Li, Si Zong Min, Ji An Duan, Lei Han, Jue Zhong
• Keywords: Atomic Diffusion, Bonded Strength, Dimples, Thermosonic Bond

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