Effect of SiC Volume Fraction on the Microstructural and Mechanical Properties of Cu/SiC Composite Layer Fabricated by FSP

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Abstract:

In this study, friction stir processing (FSP) was applied to fabricate a Cu/SiC surface composite layer by incorporation of 5 µm SiC particles. Effects of the traverse speed and SiC volume fraction on the microstructure, hardness and powder distribution pattern of the developed surface layer were investigated. Optical and scanning electron microscopy (SEM) was employed to carry out the microstructural observations. Results show that increasing the volume fraction causes an intense decrease in the grain size and increase in the hardness of the developed surface. To achieve a uniform distribution of particles and uniform microstructure, the traverse speed should decrease as far as possible.

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Defect and Diffusion Forum (Volumes 312-315)

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500-505

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April 2011

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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[1] A. Dubravina, M.J. Zehetbauer and E. Schafler, I.V. Alexandrov: Mater. Sic. Eng. A. Vol. 387-389 (2004), p.817.

Google Scholar

[2] G. Khatibi, J. Horky, B. Weiss and M.J. Zehetbauer: Int. J. Fatigue Vol. 32 (2010), p.269.

Google Scholar

[3] W. Tillmann, E. Vogli and J. Nebel: ASM International Vol. 16 (2007), p.751.

Google Scholar

[4] W. Tillmann, E. Vogli, R. Rechlin, F. -W. Bach, K. Möhwald, Z. Babiak and T. Rothardt: ASM International (2004), p.4.

Google Scholar

[5] R.S. Mishra, Z.Y. Ma and I. Charit: Mater. Sci . Eng. A. Vol. 341 (2003), p.307.

Google Scholar

[6] R. Salekrostam and M. K. Besharati Givi: Defect and Diffusion Forum Vols. 297-301 (2010), p.215.

Google Scholar

[7] R. Salekrostam, M. K. Besharati Givi, P. Asadi and P. Bahemmat: Defect and Diffusion Forum Vols. 297-301 (2010), p.221.

DOI: 10.4028/www.scientific.net/ddf.297-301.221

Google Scholar

[8] W. Wang, Q. Y. Shi, P. Liu, H. K. Li and T. Li: J. Mater. Process. Technol. Vol. 209 (2009), p. (2099).

Google Scholar

[9] Y. Morisada, H. Fujii, T. Nagaoka and M. Fukusumi: Mater. Sci. Eng. A Vol. 433 (2006), p.50.

Google Scholar

[10] Y. Morisada, H. Fujii, T. Nagaoka, M. Fukusumi: Mater. Sci. Eng., A Vol. 419 (2006). p.344.

Google Scholar

[11] W.B. Lee and S.B. Jung: Mater. Lett. Vol. 58 (2004), p.1041.

Google Scholar

[12] B.M. Darras, M.K. Khraisheh, F.K. Abu-Farha and M.A. Omar: J. Mater. Process. Technol. Vol. 191 (2007), p.77.

Google Scholar

[13] W.B. Lee and S.B. Jung: Mater. Lett. Vol. 58 (2004), p.1041.

Google Scholar

[14] G.M. Xie, Z.Y. Ma and L. Geng: Scripta Mater. Vol. 57 (2007), p.73.

Google Scholar

[15] L. Karthikeyan, V.S. Senthilkumar, V. Balasubramanian and S. Natarajan: Mater. Des. Vol. 30 (2009), p.2237.

Google Scholar

[16] K. Nakata, Y.G. Kim, H. Fujii, T. Tsumura and T. Komazaki: Mater. Sci. Eng. A Vol. 437 (2006), p.274.

Google Scholar

[17] P. Asadi, Gh. Faraji and Mohammad K. Besharati: Int. J. Adv. Manuf. Technol. (2010), in press.

Google Scholar

[18] P. Asadi, Mohammad K. Besharati and Gh. Faraji, Mater. Manuf. Processes, accepted for publication on 18 Jan (2010).

Google Scholar

[19] A. Shafiei-Zarghani, S.F. Kashani-Bozorg and A. Zarei-Hanzaki: Mater. Sci. Eng. A Vol. 500 (2009), p.84.

Google Scholar